TELICA is a multi-axes platform primarily dedicated to semiconductor back-end applications. Its dual gantry architecture provides motion along 3 degrees of freedom, X, Y and Z, for a total number of 8 controlled axes. It is designed to fulfill the most challenging requirements of advanced die bonding processes (Flip-chip, Fan-out, 3D stacked packages), µ-LED bonding, dispensing applications and more.
By design, conventional motion system architectures are EITHER optimized for high positioning accuracy OR high throughput. Thanks to a very innovative motion system architecture, TELICA meets BOTH SIMULTANEOUSLY with ±1 µm global placement accuracy (blind move) at a throughput of 10 kUPH for a typical flip chip die bonding application and up to 180 kUPH for µ-LED bonding.
TELICA is available in two standard variants: variant 1 for Wafer Level Packages (WLP) with X410 x Y445 x Z30 mm travels and variant 2 for Panel Level Packages (PLP) with X750 x Y800 x Z30 mm travels.
TELICA introduces a new metrology approach drastically reducing the Abbé errors as well as the relative positioning mismatch between process tool and substrate. Multi-dimensional encoders ensure the high placement accuracy while water cooled ironcore motors allow extreme duty cycles.
Coupled with ETEL's state-of-the-art AccurET controllers, the TELICA platform benefits from multiple control features such as: zero settling time, non-linear control, advanced feedforward and trajectory filters, full synchronization of all axes with nanosecond jitter, a specific gantry control algorithm, multidimensional mapping, advanced triggering capabilities based on real mapped position, advanced software diagnostic and system identification tools for control optimization.
Ask for the corresponding Integration Manual for more information.
TELICA variant 1
(wafer level package)
TELICA variant 2
(panel level package)