TELICA Dual gantry motion system

TELICA is a multi-axes platform primarily dedicated to semiconductor back-end applications. Its dual gantry architecture provides motion along 4 degrees of freedom, X, Y, Z and Rz, for a total number of 8 controlled axes. It is designed to fulfill the most challenging requirements of advanced die bonding processes (Flip-chip, Fan-out, Hybrid bonding, 2.5D/3D packages), µ-LED bonding, dispensing applications and more.

By design, conventional motion system architectures are EITHER optimized for high positioning accuracy OR high throughput. Thanks to a very innovative motion system architecture, TELICA meets BOTH SIMULTANEOUSLY with ±1 µm global placement accuracy (blind move) and a standard ±350 nm local accuracy at a throughput of 10 kUPH for a typical flip chip die bonding application. Up to 180 kUPH can be reached for a typical µ-LED bonding process.

With a transistor density and energy efficiency increasing drastically, the number of I/O is becoming the limiting factor on the dies on the wafer manufacturing side. Semiconductor industry is working on different solutions to overcome the need for further shrinking the pad and pitch sizes to increase the number of I/Os. For example on the back-end side, Hybrid Bonding now enables the direct pad to pad interconnect in chiplets and has become one of the most important techniques to further improve device performance without further reducing the node size. TELICA architecture in combination with vision concepts minimizing the need for blind moves has proven its ability to meet the Hybrid Bonding ±100 nm local accuracy requirement at a 2 kUPH throughput.

TELICA is available with one or two gantry beams working in parallel. Two standard variants are available: variant 1 for Wafer Level Packages (WLP) with X410 x Y445 x Z30 mm travels and variant 2 for Panel Level Packages (PLP) with X750 x Y800 x Z30 mm travels.

TELICA introduces a new metrology approach drastically reducing the Abbé errors as well as the relative positioning mismatch between process tool and substrate. Multi-dimensional encoders ensure the high placement accuracy while water cooled ironcore motors allow extreme duty cycles.

Coupled with ETEL's state-of-the-art AccurET controllers, the TELICA platform benefits from multiple control features such as: zero settling time, non-linear control, advanced feedforward and trajectory filters, full synchronization of all axes with nanosecond jitter, a specific gantry control algorithm, multidimensional mapping, advanced triggering capabilities based on real mapped position, advanced software diagnostic and system identification tools for control optimization.

Main specifications

  • ±350 nm local placement accuracy (moves with local alignment) at 10 kUPH throughput.
  • ±100 nm local placement accuracy (moves with local alignment) at 2 kUPH throughput.
  • ±1 µm global placement accuracy (blind moves).
  • <10 minutes thermal transient (from cold start to hot working state).
  • Up to 10 kUPH throughput for a typical flip chip die bonding application.
  • Up to 2 kUPH throughput for a hybrid bonding application.
  • Up to 180 kUPH throughput for µ-LED bonding.
  • Up to 4 g acceleration in X, 6 g in Y and 7.5 g in Z.
  • Up to 2 m/s speed in X and Y and 1 m/s in Z.
  • ISO 5 cleanroom compatible.

Ask for the corresponding Integration Manual for more information.

DescriptionData sheetInterface drawing3D model

TELICA variant 1

(wafer level package)

On request 

TELICA variant 2

(panel level package)

On request On request