Faster, more efficient, more reliable?

See you at semicon Taïwan!

In advanced semiconductor processes, force must be controlled — not just applied.
 
HEXAMAG can apply controlled force at virtually any point on the substrate — while simultaneously controlling all other DOFs.
 
✔ Specific force control algorithm
✔ Up to 80 N force application
✔ Real-time force control
✔ Minimal force overshoot (10N ±0.1%)
✔ Simultaneous force and position loops
 
This unlocks entirely new possibilities for delicate semiconductor processes.
 
Force control becomes part of the motion architecture itself.
The result:
— Cleaner interaction
— Safer substrate handling
— Reproducible force control anywhere on the substrate
— More repeatable force-sensitive processes
— Preservation of fragile die integrity
 
A new level of control for Hybrid Bonding and advanced semiconductor manufacturing.
 
➡ Read in the next chapter: How frictionless architecture creates a cleaner semiconductor environment.

⬅️ previous chapter: Active stabilization
 
#HEXAMAG #ForceControl #HybridBonding #PrecisionEngineering #SemiconductorOEM #AdvancedPackaging #MotionControl

At nanometer scale, stability becomes balance.
 
HEXAMAG continuously measures and compensates disturbances in real time across all 6DOF.
 
Thermal drift. Structural breathing. Floor vibrations. Cross-axis coupling.
Everything is actively stabilized.
 
The outcome:
✔ ±2 nm stability @1kHz along X, Y and Z directions
 
For semiconductor OEMs, this means:
— More stable overlay
— Better bonding consistency
— Reduced process drift
— Higher yield potential
 
Because every nanometer impacts throughput and yield.
HEXAMAG transforms stability into measurable process performance.
 
➡ Read in the next chapter: How HEXAMAG enables high precision force control.

⬅️ previous chapter: Precision at the process plane
 
#HEXAMAG #ActiveStabilization #NanometerStability #SemiconductorTechnology #HybridBonding #PrecisionMotion #SemiconductorOEM #LowJitter

At Semicon Taiwan 2026, ETEL & HEIDENHAIN will showcase HEXAMAG, its newest motion system built to meet the toughest challenges in hybrid bonding. This breakthrough solution is the result of strong synergies across the HEIDENHAIN Corporate Group. Visit us on the booth !

True precision starts exactly where the process happens.
 
HEXAMAG integrates HEIDENHAIN MultiDOF metrology directly at the process plane.
 
Why does this matter?
Because closing the control loop exactly where the process occurs minimizes Abbe errors and maximizes repeatability.
 
Performance:
✔ <±50 nm over 50 mm accuracy
✔ ±10 nm repeatability
✔ Sub-nanometer encoder resolution
 
The result:
— Higher overlay accuracy
— Fewer calibration interventions
— Tighter process windows
— Higher process consistency
— Higher Yield
 
Exactly what next-generation semiconductor processes require.
 
➡ Read in the next chapter: How HEXAMAG keeps motion perfectly stable at nanometer scale.

⬅️ previous chapter: Dynamics redefined
 
#HEXAMAG #Metrology #HEIDENHAIN #NanometerPrecision #Semiconductor #HybridBonding #PrecisionEngineering #OverlayAccuracy