METIS Planar platform
ASAI-YGNN-06-0320-0320xx-XYZT PLANAR PLATFORM
This platform, METIS, is a hybrid planar mechanical/air bearing platform dedicated to step and scan applications. It is a 6 axes platform moving in X, Y, Z and Theta directions. Dynamic flatness over the full travel as well as bidirectional repeatability are key parameters. This platform is currently used in:
- Wafer Process Control applications such as Critical Dimension and Thin film Metrology.
- Wafer scribing
- Wafer Laser Thermal Annealing
It might also be used in Back End Of Line Lithography machines (mask aligners) and in some wafer dicing application.
This platform features:
- Flatness of motion given by the air bearing
- Unlimited rotation in Theta
- Double Z integration: Coarse travel for loading/unloading and fine travel for focus adjustement
- Buit-in gravity compensator in Z (patent pending)
- Yaw correction can be done by slightly shifting the Y1 and Y2 motors
- Can be further integrated with an Active Isolation System fully controlled by ETEL
- Travels in X and Y can be made longer with some limitations on the performance
Main specifications
| Description | Y1,Y2 | X | Fine Z | Coarse Z | Theta |
|---|---|---|---|---|---|
| Total stroke | 320 mm | 320 mm | 4 mm | 12 mm | infinite |
| Maximum speed | 1.2 m/s | 1.2 m/s | 0.1 m/s | 0.02 m/s | 15.7 rad/s |
| Maximum acceleration | 12 m/s2 | 12 m/s2 | 2 m/s2 | 1 m/s2 | 104.7 rad/s2 |
| Position stability | ±25 nm | ±25 nm | ±15 nm | - | ±0.2 arcsec |
| Bidirectional repeatability | ±0.4 µm | ±0.4 µm | ±0.3 µm | - | ±2 arcsec |
| Maximum payload | 1 kg | ||||
Ask for the corresponding Integration Manual for more information.
| Description | Data sheet | Interface drawing | 3D model |
|---|---|---|---|
| METIS |  | | On request |