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Wafer dicing/scribing

Dicing is primarily about maintaining the integrity and functionality of the individualised components. In addition, chipping, cracks or other deformations of the sensitive chip structures should be avoided.

As the constant pressure to produce more with fewer resources continues and the features continue to shrink, the tolerances and margins for dicing are also being reduced to a minimum. The direct result is that dicing lines must be more precise and accurate than ever before, presenting a challenge to motion system manufacturers.

ETEL provides motion systems with minimal inherent inaccuracies, complemented by metrology concepts and mapping technologies, to elevate dynamic straightness to a new level.

wafer scribing

Motion systems

Motion control

Do not hesitate to contact us to find out more about ETEL’s innovative and precise solutions.