Planar platforms

ASAI-YGNN-06-0320-0320xx-XYZT Planar Platform

ASAI-YGNN-06-0320-0320xx-XYZT Planar Platform
ASAI-YGAW-06-0320-0320xx-XYZT Planar Platform

This platform, Metis, is a hybrid planar mechanical/air bearing platform dedicated to step and scan applications. It is a 6 axes platform moving in X, Y, Z and Theta directions. Dynamic flatness over the full travel as well as bidirectional repeatability are key parameters. This platform is currently used in:

  • Wafer Process Control applications such as Critical Dimension and Thin film Metrology.
  • Wafer scribing
  • Wafer Laser Thermal Annealing

It might also be used in Back End Of Line Lithography machines (mask aligners) and in some wafer dicing application.

This platform features:

  • Flatness of motion given by the air bearing
  • Unlimited rotation in Theta
  • Double Z integration: Coarse travel for loading/unloading and fine travel for focus adjustement
  • Buit-in gravity compensator in Z (patent pending)
  • Yaw correction can be done by slightly shifting the Y1 and Y2 motors
  • Can be further integrated with an Active Isolation System fully controlled by ETEL
  • Travels in X and Y can be made longer with some limitations on the performance

Main features

  • Total stroke: 320 mm for XY x 12 mm for Z
  • Speed: 1.2 m/s for XY, 0.1 m/s for Z and 15.7 rad/s for T
  • Acceleration: 1.2 g for XY, 0.2 g for Z and 104.7 rad/s2 for T
  • Position stability: ±25 nm for XY, ±15 nm for Z and ±0.2 arcsec for T
  • Bidirectional repeatability: ±0.4 µm for XY, ±0.3 µm for Z and ±2 arcsec for T

Ask for the corresponding Integration Manual for more information.

DescriptionData sheetInterface drawing3D model
ASAI-YGNN-06-0320-0320xxOn request
Print