Combined modules


Z3TH Combined Module

The Z3TH Combined Module is enlarging the scope of modules that can sit on top of the existing XY platforms. The Z3TH, 4 degrees of freedom module, provides 364° Theta rotation, double Z-axes, a coarse one for wafer loading and unloading, and a fine one for focus adjustment, as well as a Tip and Tilt correction over ±0.1°. This Z3TH module is a nice alternative to piezo based Z actuators, eliminating the hysteresis and non-linearity in open loop while offering better tracking error during movement, repeatability, and move and settle performance yet over much longer travels.

The Z3TH module is primarily dedicated to front-end type of applications and provides a right solution to cope with any applications requiring:

  • Alignment between a process tool and a substrate
  • Mapping of flatness
  • Move and settle improvement

First applications are related to back-end lithography and wafer process control.


  • 364° Theta rotation
  • Tip and tilt correction over ±0.1° for leveling and for move and settle improvement
  • Vacuum feed-through to the chuck level
  • Double Z integration: coarse travel for loading/unloading and fine travel for focus adjustment
  • ISO class 1 clean room compatibility
  • Low radial axial and radial runout of ±1 µm

Ask for the corresponding Integration Manual for more information.

Main features

DescriptionFine ZTip-TiltCoarse ZTheta
Travel range±2 mm±0.1°16 mm364°
Maximum speed---10 rad/s
Maximum acceleration---55 rad/s2
Position stability±1.9 nm±0.0043 arcsec-±0.0038 arcsec
Bidirectional repeatability±0.010 µm--±0.35 arcsec
Move and settle time
(100 µm within ±30 nm)
45 ms---
Move and settle time
(180° within ±20 µ°)
525 ms
Maximum payload2 kg



DescriptionData sheetInterface drawing3D model




ASME-NNNN-03-0012-0004xx-ZT combined module

The ZT box is a module combining two degrees of freedom, in Z and Theta, within one single unit. Two actuations are possible along the Z direction, a coarse one and a fine one. This module can be used in a standalone mode or mounted on top of an XY platform. This module is especially well suited for wafer process control applications such as thin film metrology, critical dimensions, etc.


  • Infinite rotation
  • Built-in vacuum supply at wafer chuck level
  • Built-in gravity compensator
  • ISO1 clean room compatible thanks to vacuum suction
  • Coarse Z axis with 12 mm stroke for wafer loading/unloading and fine Z with 4 mm stroke for focus adjustment
  • Version without a coarse Z can be done
  • Very good Z jitter as well as move and settle

Main features

  • Bidirectional repeatability: ±0.3 µm for Z and ±2 arcsec for T
  • Position accuracy: ±0.6 µm for Z and ±3 arcsec for T
  • Speed up to: 0.1 m/s for Z and 15.7 rad/s for T
  • Acceleration up to: 0.2 g for Z and 104.7 rad/s² for T
  • Position stability: ±5 nm for Z and ±0.2 arcsec for T
  • Load capacity: 1 kg

Ask for the corresponding Integration Manual for more information.

DescriptionData sheetInterface drawing3D model