TELICA HP
TELICA HP is an advanced evolution of our TELICA platform, specially designed to address the demanding challenges of advanced-packaging applications. This ISO3 compatible system delivers exceptional tool-point stability and repeatability, making it the ideal turnkey solution for hybrid bonding and thermo-compression bonding applications.
Advanced packaging calls for increasingly high placement accuracy while maintaining high throughput levels. This challenge inspired the development of our TELICA HP platform, engineered to excel in both domains.
To deliver exceptional accuracy, TELICA HP integrates upgraded encoders and electronics for superior position control. Its built-in secondary metrology — decoupled from the force frame — enables real-time compensation for Abbé, dynamic, and thermal errors.
Combined with advanced mapping techniques and high payload capacity, this ensures unmatched tool-point stability, position retention, and repeatability, even under challenging conditions.
TELICA HP also includes water cooling as a standard feature, allowing sustained thermal stability and higher duty cycles. This means your throughput is no longer limited by the motion system — processes can run faster and longer without compromising precision or cleanliness. TELICA HP is the turnkey solution for customers seeking speed, stability, and uncompromising performance in next-generation packaging.
Bidirectional repeatability
Position stability
Throughput
Design
| Architecture | Dual gantry |
| Bearing | Mechanical |
| Motor | Ironcore |
| Cooling | Active |
| Isolation | QUIET active isolation |
| Metrology | Decoupled metrology frame |
| DoF | 6 (2x XYZ) |
System capabilities
| Stroke | Up to 750 x 800 mm |
| Substrate dimensions | Up to 600 x 600 mm |
| Payload | Up to 10 kg per gantry |
| Cleanliness | ISO 3 |
| Global accuracy | 1 µm (with mapping) |
| Repeatability | ±50 nm for small moves |
| Acceleration | Up to 1.3 g |
| Speed | Up to 0.75 m/s |
| Position jitter | < 15 nm |
TELICA HP platform
Here are the key features of our models:
Our enhanced motion systems now feature upgraded encoders and electronics to deliver exceptional position control. In combination with decoupled secondary metrology, embedded as a standard feature, we compute a theoretical tool-point position and actively compensate for Abbé, dynamic, and thermal errors. This ensures consistently precise and repeatable motion, as well as stable position retention — critical for advanced packaging processes.
TELICA without MMF => 5.2 nm drift
TELICA with MMF => 1.4 nm drift
Our integrated water cooling solution enables higher duty cycles and improved thermal stability. This allows the motion system to run longer and faster without overheating, delivering consistent performance and significantly increased throughput.
TELICA HP features laminated flat cables and patented particle management solutions to meet demanding cleanliness standards. These innovations minimize contamination risks and ensure optimal performance in sensitive environments—helping customers achieve higher yields and better product reliability.
Thanks to our QUIET POD active isolation system, TELICA HP offers very low transmissibility and allows you to run your process on noisy floors. Additionally, drive forces of 10 axes can be compensated by up to 99%, ensuring outstanding machine stability and minimal impact on your process.
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