METIS CIP
Introducing METIS CIP, a state-of-the-art hybrid planar mechanical/air bearing platform designed for step and scan applications, ensuring unparalleled accuracy, move & settle times and speed stability over 4 degrees of freedom.
The METIS CIP platform is a cutting-edge hybrid planar mechanical/air bearing platform, dedicated to step and scan applications with four-axis movement in X, Y, Z, and Theta directions. Its dynamic flatness over the full travel range and bidirectional repeatability make it ideal for high-precision tasks. METIS CIP is widely used in Wafer Process Control applications such as Critical Dimension and Thin Film Metrology, Wafer Scribing, and Wafer Laser Thermal Annealing.
Thanks to 20 years experience of production and technical support, the METIS CIP design benefits from ETEL’s expertise in robustness, serviceability, and performance.
Bidirectional repeatability
Speed / acceleration
Position stability
Design
| Architecture | Planar gantry |
| Bearing | Air & mechanical bearing |
| Motor | Ironless |
| Isolation | QUIET active isolation |
| DoF | 4 with module |
Module compatibility
| Standard | ZT (fine Z, coarse Z and infinite theta) |
| On demand | Z3TM+, DXR+ and DXRH |
System capabilities
| Stroke | 320 x 320 mm (on demand: X up to 750 mm / Y up to 450 mm) |
| Substrate dimensions | 300 x 300 mm |
| Payload | Up to 10 kg (without module) and 1 kg with ZT module |
| Cleanliness | ISO 2 |
| Global accuracy | ±150 nm (with mapping) |
| Repeatability | ±1 µm |
| Acceleration | Up to 2 g |
| Speed | Up to 1.2 m/s |
| Straightness | ±2 µm |
| Typical move & settle | 60 ms for 10 µm within 100 nm 150 ms for 20 mm within 100 nm |
METIS CIP platform
Here are the key features:
Thanks to the repeatability performance, with mapping METIS CIP can reach an accuracy of ±1 µm on the overall wafer area.
METIS CIP ironless motors size is upgraded to reach an acceleration of 2g for high throughput.
A coarse Z axis for wafer loading/unloading and a fine Z axis for wafer Z fine positioning.
Design to ease the access for maintenance, and new FRU easy to replace, METIS CIP benefits of decades of experiences making it a robust product in production.
The new module is designed to enhance the prevent any contamination risk at wafer level.
Fully compatible with QUIET active isolation system for better immunity to vibration and higher process stability.
Downloads
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METIS CIP | Documents | |