From September 10–12, 2025, the SEMICON Taiwan exhibition will take place at the Taipei Nangang Exhibition Center. Join us in hall 1 at booth K2776.
This year’s spotlight is on Advanced Packaging and the evolution of Heterogeneous Integration—key drivers shaping the next generation of Integrated Circuits. These innovations are revolutionizing the Semiconductor Equipment Industry, leading to:
- A surge in advanced bonding and inspection processes for die and chiplet interconnection
- Enhanced equipment performance in terms of dynamic accuracy, thermal stability, throughput, jitter, cleanliness and more
- A deployment of processes on larger substrates moving from wafer to panel
At the HEIDENHAIN Group booth, ETEL will showcase cutting-edge motion systems designed to meet these challenges head-on. Here’s what you’ll discover:
For Die Sorters
High-throughput, force-controlled die handling solution for optimal sorting of Known Good Dies, featuring:
- our new RTMC indexing table
- our high Performance TMMA Z actuators
- our new ACCURET+ QUAD controller offering reduced real estate and optimized performance to cost ratio
- our FalconTouch software improving yield and throughput through an optimized Z trajectory generation, at very high dynamics, while ensuring a smooth landing at the end of motion
For Advanced Bonders (TCB & Hybrid Bonding)
Introducing TELICA HP: a breakthrough dual gantry system for Hybrid and Thermo Compression bonding:
- Nanometer-level position stability
- < 50 nm XY repeatability
- Integrated QuiET Active Isolation System
- ISO3 cleanroom compatibility
For Metrology / Inspection equipment
VULCANO2 platform: high dynamics and high accuracy for point-to-point and scanning applications:
- VULCANO2 platform with high dynamics and nanometer-level accuracy
- 2.5 g acceleration with high payload capacity
- Ideal for process control and packaging inspection
For any Advanced Equipment
MultiDOF encoders and metrology solutions, the brand-new fourth-generation ACCURET+ controller, the QUIET active isolation system, all these demonstrated on ETEL’s motion systems, and delivering:
- Enhanced throughput, accuracy, and jitter
- Faster time to performance, enabled by intuitive and dedicated software and utilities improving user experience
- Unmatched performance at the tool point thanks to innovative metrology integration
We look forward to connecting with you and exploring the future of semiconductor innovation together. See you in Taipei!
Full program: SEMICON Taiwan Program
