TELICA is a multi-axes platform primarily dedicated to semiconductor back-end applications. Its dual gantry architecture provides motion along 4 degrees of freedom, X, Y, Z and Rz, for a total number of 8 controlled axes. It is designed to fulfill the most challenging requirements of advanced die bonding processes (Flip-chip, Fan-out, Hybrid bonding, 2.5D/3D packages), µ-LED bonding, dispensing applications and more.
By design, conventional motion system architectures are EITHER optimized for high positioning accuracy OR high throughput. Thanks to a very innovative motion system architecture, TELICA meets BOTH SIMULTANEOUSLY with ±1 µm global placement accuracy (blind move) and a standard ±350 nm local accuracy at a throughput of 10 kUPH for a typical flip chip die bonding application. Up to 180 kUPH can be reached for a typical µ-LED bonding process.
With a transistor density and energy efficiency increasing drastically, the number of I/O is becoming the limiting factor on the dies on the wafer manufacturing side. Semiconductor industry is working on different solutions to overcome the need for further shrinking the pad and pitch sizes to increase the number of I/Os. For example on the back-end side, Hybrid Bonding now enables the direct pad to pad interconnect in chiplets and has become one of the most important techniques to further improve device performance without further reducing the node size. TELICA architecture in combination with vision concepts minimizing the need for blind moves has proven its ability to meet the Hybrid Bonding ±100 nm local accuracy requirement at a 2 kUPH throughput.
